Wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances

HS v2022 Code: 441019

About wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances

HS code 441019 covers a range of engineered wood products known as wafer boards or similar boards. These panels are widely used in the construction and furniture industries due to their durability, versatility, and cost-effectiveness. As a key component in the global wood processing sector, the production and trade of these boards play a significant role in the broader economy.

Production process

Wafer boards are typically manufactured by compressing and bonding wood strands or flakes using resin or other organic binding agents. The process involves several key steps, including the preparation of wood raw materials, the formation of the wood strands or flakes, the application of the binding agent, and the pressing and curing of the final board product. Advanced techniques, such as the use of automated machinery and precise control of temperature and pressure, help ensure the consistent quality and performance of these engineered wood panels.

Production inputs

The main inputs required for the production of wafer boards under HS code 441019 include wood raw materials, such as softwood or hardwood logs, as well as resin or other organic binding agents. Specialized machinery, such as flakers, dryers, and presses, are also essential for the manufacturing process. Additionally, energy sources, such as electricity or natural gas, are needed to power the production equipment.

Production outputs

Wafer boards produced under HS code 441019 are primarily used in the construction and furniture industries. These panels are often used as structural components in walls, floors, and roofs, as well as in the production of various furniture items. The output of this industry may also be consumed by manufacturers of 441011 Particle board, 441213 Plywood, and other related wood-based products.

Revisions to 441019

Classification codes are adjusted frequently. The code may have been revised or replaced between system versions. The table below shows the history (newest to oldest) of the code 441019. The most recent 1 version of this code (441019) is in the HS v2022 system (this version):

This page shows the most recent version of code 441019.

Family tree for wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances

    graph LR
    A["<a href='/classifications/hs/v2022/44'>44: Wood and articles of wood; wood charcoal</a>"]
A --> B["<a href='/classifications/hs/v2022/4410'>4410: Particle board, oriented strand board (OSB) and similar board (e.g. waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances</a>"]
B --> C["<a href='/classifications/hs/v2022/441019'>441019: Wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances</a>"]

    B --> D["<a href='/classifications/hs/v2022/441011'>441011: Particle board of wood, whether or not agglomerated with resins or other organic binding substances</a>"]
B --> E["<a href='/classifications/hs/v2022/441012'>441012: Oriented strand board (OSB) of wood, whether or not agglomerated with resins or other organic binding substances</a>"]
B --> F["<a href='/classifications/hs/v2022/441090'>441090: Particle board, oriented strand board (OSB) and similar board of ligneous materials other than wood, whether or not agglomerated with resins or other organic binding substances</a>"]

    

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