Wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances

HS v2017 Code: 441019

About wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances

HS code 441019 covers a range of engineered wood products known as wafer boards or similar boards. These panels are widely used in the construction and furniture industries, providing a cost-effective and versatile alternative to solid wood. As a key component in many building and interior applications, the wafer board industry plays a vital role in the broader wood products sector and the overall economy.

Production process

Wafer boards are typically produced by arranging thin wood wafers or flakes in layers and then bonding them together with resin or other organic binders. The layers are then pressed and heated to cure the adhesive, creating a durable and dimensionally stable panel. This manufacturing process allows for the efficient utilization of wood resources and the production of boards in a variety of sizes and thicknesses to meet diverse market demands.

Production inputs

The primary raw material inputs for the wafer board industry are wood flakes or wafers, typically sourced from softwood species such as pine or fir. Resin binders, such as urea-formaldehyde or phenol-formaldehyde, are also essential for the production process. Specialized machinery, including flakers, dryers, and hot presses, are required to transform the raw materials into the final wafer board products.

Production outputs

Wafer boards produced under HS code 441019 are widely used in the construction and furniture industries. They are commonly used as structural panels, subfloors, and sheathing in residential and commercial buildings. Additionally, these boards are often used in the manufacture of furniture, cabinetry, and other wood-based products 441820 Furniture, wooden, n.e.c..

Revisions to 441019

Classification codes are adjusted frequently. The code may have been revised or replaced between system versions. The table below shows the history (newest to oldest) of the code 441019. The most recent 1 version of this code (441019) is in the HS v2022 system:

This page shows a legacy version of code 441019 ( HS v2017).

Older versions

Family tree for wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances

    graph LR
    A["<a href='/classifications/hs/v2017/44'>44: Wood and articles of wood; wood charcoal</a>"]
A --> B["<a href='/classifications/hs/v2017/4410'>4410: Particle board, oriented strand board (OSB) and similar board (e.g. waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances</a>"]
B --> C["<a href='/classifications/hs/v2017/441019'>441019: Wafer board and similar board of wood n.e.c. in item no. 4410.1, whether or not agglomerated with resins or other organic binding substances</a>"]

    B --> D["<a href='/classifications/hs/v2017/441011'>441011: Particle board of wood, whether or not agglomerated with resins or other organic binding substances</a>"]
B --> E["<a href='/classifications/hs/v2017/441012'>441012: Oriented strand board (OSB) of wood, whether or not agglomerated with resins or other organic binding substances</a>"]
B --> F["<a href='/classifications/hs/v2017/441090'>441090: Particle board, oriented strand board (OSB) and similar board of ligneous materials other than wood, whether or not agglomerated with resins or other organic binding substances</a>"]

    

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